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back grinding machines in semiconductor

Semiconductor BackGrinding The silicon wafer on which the active elements are created is a thin circular disc typically 150mm or 200mm in diameter During diffusion and similar processes the wafer may become bowed but wafers for assembly are normally stress relieved and can be regarded as flat

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Our products sell well all over the world,and have advanced technology in the field of crushing sand grinding powder.

Grinding Machine for Semiconductor Wafers
Grinding Machine for Semiconductor Wafers

Grinding Machines for Semiconductor Wafers Koyo Machine Industries developed several types of grinding machines used in the semiconductor industry for silicon wafer manufacturing and IC production Vertical and horizontal spindle systems are used in combination with special designed diamond grinding wheels that cut just at the edge of the rinding wheel resulting in high grinding speed and producing

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AdwillSemiconductorrelated Products  LINTEC Corporation
AdwillSemiconductorrelated Products LINTEC Corporation

The LINTEC Adwill series includes UV curable dicing tapes high performance back grinding tapes dicing die bonding tapes required for semiconductor packaging and backside coating tapes Adwill continues to make steady progress in the advancement of related equipment and unique systems

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Back Grinding Wheels for Silicon Wafer
Back Grinding Wheels for Silicon Wafer

Back Grinding wheel Application of back grinding wheels back thinning grinding and fine grinding of apphire epitaxial wafer silicon wafer gallium arsenide and GaN wafer Grinding Machines Okamoto Disco TSK and STRASBAUGH etc Bonded Vitrified bond Resin bond Diameter mm D175 D195 D209 D305 D335 etc Manufacturing Processes for Silicon Wafers Ingot cropping Peripheral

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Wafer Grinder Finishing  Grinding Machines  Koyo
Wafer Grinder Finishing Grinding Machines Koyo

Description Special grinder for hard but brittle precision grinder to replace lapping machines Fully automated cassette to cassette operation Grinding

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Back Grinding Machines In Semiconductor
Back Grinding Machines In Semiconductor

Back Grinding Machines In Semiconductor Protection Tape Applicator For Backgrinding Process Nel Fullauto type Semiauto type machines are lined up and large size wafers are also available

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Silicon Back Grinding  Products  Suppliers  Engineering360
Silicon Back Grinding Products Suppliers Engineering360

and cover glass for micro arrays Its coefficient of thermal expansion CTE of 38 x 107 is well matched to silicon making it an ideal and economi­cal choice for use as a glass polishing substrate for the thinning process back grinding of semiconductor chips supporting low profile

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Semiconductor Production Process|Semiconductor
Semiconductor Production Process|Semiconductor

ACCRETECHTOKYO SEIMITSU is primarily engaged in the sale of equipment such as wafer slicing machines that cut silicon crystal ingots into silicon substrates called wafers upon which semiconductor processing is conducted and wafer edge grinding machines that chamfer the edges of the wafers

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Back Lapping Semiconductor Wafers  Ceramic Industry
Back Lapping Semiconductor Wafers Ceramic Industry

Mar 01 2001 · Back lapping is the thinning of semiconductor wafers by removing material from the rear ie the unpolished or unprocessed face Back Lapping Semiconductor Wafers This website requires certain cookies to work and uses other cookies to help you have the best experience

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Product Information  Grinding Wheels  DISCO Corporation
Product Information Grinding Wheels DISCO Corporation

DISCOs grinding wheels grind silicon compound semiconductors crystals and a wide variety of other materials They are an essential part of DISCOs excellent Kezuru Grinding solutions For Your Safety

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Wafer dicing  Wikipedia
Wafer dicing Wikipedia

In the context of manufacturing integrated circuits wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer The dicing process can involve scribing and breaking mechanical sawing normally with a machine called a dicing saw

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Custom Silicon Wafer Back Grinding Services  SVM
Custom Silicon Wafer Back Grinding Services SVM

Back grinding is a process that removes silicon from the back surface of a wafer Silicon Valley Microelectronics provides grinding on our own substrates or on customer supplied wafers We process bare and device patterned wafers with high yield and offer wafer thinning to customer specifications

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China Back Grinding Machine for 12 Wafer  China Wafer
China Back Grinding Machine for 12 Wafer China Wafer

This machine can auto aiming the tool actually test the grinding torqueautomatic adjust the grinding speed so to avoid broking the wafer 1Can grind the wafer to 80um and the planeness and parallelism can be 0002mm 2High speed LED sapphire substrate can be 48umminute silicon wafer can be 250umminute Specification

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Wafer Detaping Machineid887181 Buy Semiconductor Back
Wafer Detaping Machineid887181 Buy Semiconductor Back

View product details of Wafer Detaping Machine from Ssemizone Co Ltd manufacturer in EC21 Wafer Detaping Machineid887181 View product details of Wafer Detaping Machine from Ssemizone Co Ltd manufacturer in EC21 There are 11 Semiconductor Back Grinding from 9 suppliers on Related Searches machine machinery

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Back Grinding Wheels for Silicon Wafer
Back Grinding Wheels for Silicon Wafer

Back Grinding wheel Application of back grinding wheels back thinning grinding and fine grinding of apphire epitaxial wafer silicon wafer gallium arsenide and GaN wafer Grinding Machines Okamoto Disco TSK and STRASBAUGH etc Bonded Vitrified bond Resin bond Diameter mm D175 D195 D209 D305 D335 etc Manufacturing Processes for Silicon Wafers Ingot cropping Peripheral

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Semiconductor Wafer Polishing and Grinding Equipment
Semiconductor Wafer Polishing and Grinding Equipment

The semiconductor wafer polishing and grinding equipment market is segmented by geography North America Europe AsiaPacific and Rest of the World Get 20 OFF on this Report

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silicon wafer back grinding
silicon wafer back grinding

Semiconductor BackGrinding The silicon wafer on which the active elements are created is a thin circular disc typicallymm ormm in diameter During diffusion and similar processes the wafer may become bowed but wafers for assembly are normally stress relieved and can be regarded as flat

Get Price
Wafer Grinder Finishing  Grinding Machines  Koyo
Wafer Grinder Finishing Grinding Machines Koyo

Industry Information TechnologySemiconductor Grinding CapacityLapping capacity Ø200 – Ø300mm Description Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers

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wafer back grinding process  In de wolken
wafer back grinding process In de wolken

Back Grinding For Bare Device Patterned WafersSVMInc 25 May 2013 Back grinding is a process that removes silicon from the back surface of a wafer SVM provides grinding on our own substrates or on customer supplied wafers We process bare and device patterned wafers with high yield and Read More

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Back Lapping Semiconductor Wafers  Ceramic Industry
Back Lapping Semiconductor Wafers Ceramic Industry

Mar 01 2001 · Back Lapping Semiconductor Wafers This process is usually applied to silicon the key substrate for semiconductor devices Back lapping is also a key process for compound semiconductors such as gallium arsenide GaAs and indium phosphide InP The downstream use of these materials includes communication devices such as cell phones and modems

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Special purpose grinding machines  Grinding Machines
Special purpose grinding machines Grinding Machines

China YNCYIDA NIPPEI MACHINE TOOL Corporation Manufacture and sales of generalpurpose CNC machine tools transfer machines and parts No11 Software

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Wafer Back Grinding Tapes  AI Technology Inc
Wafer Back Grinding Tapes AI Technology Inc

Wafer Back Grinding Tapes AIT reversible bonding wax film and spin coating adhesive solutions are also ideal for carrier or submount substrate backthinning and backside lithography processing These carrier or submount substrates are typically sapphire quartz glass or in some cases Si wafers

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Semiconductor Production Process|Semiconductor
Semiconductor Production Process|Semiconductor

ACCRETECH Products in Semiconductor Production Process Wafer Manufacturing ACCRETECHTOKYO SEIMITSU is primarily engaged in the sale of equipment such as wafer slicing machines that cut silicon crystal ingots into silicon substrates called wafers upon which semiconductor processing is conducted and wafer edge grinding machines that chamfer the edges of the wafers

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Grinding of silicon wafers A review from historical
Grinding of silicon wafers A review from historical

In back grinding the removal amount is typically a few hundred microns in wafer thickness Usually back grinding is carried out in two steps coarse grinding and fine grinding Coarse grinding employs a coarse grinding wheel with larger diamond abrasives to remove majority of the total removal amount

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Wafer Back Grinding  네이버 블로그
Wafer Back Grinding 네이버 블로그

Semiconductor backgrinding The grinding process Reducing stresses and flaws The silicon wafer on which the active elements are created is a thin circular disc typically 150mm or 200mm in diameter During diffusion and similar processes the wafer may become bowed but wafers for assembly are normally stress relieved and can be regarded as

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Surface  Meister Abrasives AG Andelfingen CH
Surface Meister Abrasives AG Andelfingen CH

Meister Abrasives diamond back grinding wheels are used to process silicon wafers and compound semiconductor materials GaAs Ge SiC GaN AlN etc to the thinnest thickness at lowest TTV The low force diamond wheels improve the process quality by reducing sub surface damage and chipping

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Wafer Grinding Wholesale Home Suppliers  Alibaba
Wafer Grinding Wholesale Home Suppliers Alibaba

Precision automatic metallographic lappingpolishing machine for polishing semiconductor wafers up to 4 diameter US 5100054000 Set 1 Set Min Order 5 YRS Tags Sapphire And Sic Wafer Back Grinding Machine Automatic Control Back Grinding Machine double crystal silicon wafers lapping and polishing US 1000016129 Set

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Semiconductor Manufacturing Equipment  USITC
Semiconductor Manufacturing Equipment USITC

processing equipment5 Backend equipment is used to assemble package and test6 semiconductors This equipment is used primarily in the latter part of the production process Figure 1 Major product segments of the semiconductor manufacturing equipment industry Frontend equipment Silicon wafer manufacturing equipment

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